Home>Technology
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PCB Capability
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2023 |
| Laminate Material |
FR-4 ,FR2, FR1, CEM-1, CEM-3 , Halogen-Free, Ceramic filled , Teflon,
Polyimide（PI）, Polyethylene terephthalate(PET) Bismaleimide
Triazine（BT）,PTFE,Al and Cu Insulated Metal Substrate(Al&Cu
IMS), etc.
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Max. Layer
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60 layer
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Max. Board Size
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1150mmX560mmX10mm
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Layer to layer registration |
+/-5mil |
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Min. line width/spacing
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Inner layer:Mass production:2.5mil/2.5mil, Pilot run: 2.2mil/2.2mil Outer layer :Mass production:3mil/3mil, Pilot run: 2.5mil/2.5mil |
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Copper Wight |
Mass production 1-6.0 OZ/ Pilot run:12 OZ
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Min. Hole Size |
Mechanical drill: Mass production: 8mil(0.2mm), Pilot run 6mil(0.15mm) Laser drill: Mass production: 6mil(0.15mm), Pilot run 4mil(0.1mm) |
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Aspect Ratio |
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| Surface Finishment |
HASL,Immersion Gold(ENIG), Immersion Tin, Imssersion Silver, OSP+ENIG, Gold Finger(GF), GF+OSP, GF+HASL,GF+ENIG,etc; |
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PCB Type |
Rigid PCB, Rigid-Flex PCB, Flexible PCB, Embeded resistor PCB, Multilayer PTFE PCB, Package Substrate |
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Special Process |
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid Material Press(Hybrid Multiylay Board),High Density, Back drill,Laser drill, Impedence Control,Copper filled PTH, Copper Filled BVH, Copper Paste Filled, Cap Plating of Filled Hole, Epoxy Filled Hole, etc; |
| PCBA capability |
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Processing Capability |
Max PanelSize: 850*560mm Min. Component Size:01005 Max.Component Size: 200125 mm Min. BGA Pitch:0.25mm SMT Mounting Precision:0.22um |
| Advanced ProcessTechnology |
SMT through-hole reflow soldering process Conformal coating Lead/ Lead-free reflow soldering processSelective lead-free wave soldering process Red glue printing soldering process Automatic cleaning process Lead/ Lead-free wave soldering process High-precision press-fit technology BGA automatic repair process |
| Test |
Online solder paste inspection Flying probe test Function test AOI automatic test ICT test Reliability test |